Pre-project publications



  • G.-H. Duan, S. Olivier, C. Jany, S. Malhouitre, A. Le Liepvre, A. Shen, X. Pommarede, G. Levaufre, N. Girard, D. Make, G. Glastre, J. Decobert, F. Lelarge, R. Brenot, and B. Charbonnier “Hybrid III-V Silicon Photonic Integrated Circuits for Optical Communication Applications”, Invited paper, IEEE. J. Selected Topics on Quantum Electronics, vol. 22, No. 6, OVEMBER/DECEMBER 2016
  • G-H. Duan, A. Accard, P. Kaspar, C. Jany,, A. Le Liepvre, D. Make, G. Levaufre, N. Girard, A. Shen, J. Decobert, N. Legay, F. Lelarge, F. Mallecot, P. Charbonnier, H. Gariah, J.-L. Gentner, S. Olivier, S. Malhouitre, C. Kopp, and S. Menezo, “New Advances on Heterogeneous Integration of III-V on Silicon”, Invited paper, J. Lightwave Technology, 2015.
  • G.-H. Duan, C. Jany, A. Le Liepvre, A. Accard, M. Lamponi, D. Make, P. Kaspar, et al., « Hybrid III-V on Silicon UNITYfor photonic integrated circuits on Silicon”, Invited Paper, IEEE. J. Selected Topics on Quantum Electronics, vol.. 20, No. 4, JULY/AUGUST 2014.
  • G-H. Duan, A. Accard, P. Kaspar, C. Jany,, A. Le Liepvre, D. Make, G. Levaufre, N. Girard, A. Shen, J. Decobert, N. Legay, F. Lelarge, F. Mallecot, P. Charbonnier, H. Gariah, J.-L. Gentner, S. Olivier, S. Malhouitre, C. Kopp, and S. Menezo, “New Advances on Heterogeneous Integration of III-V on Silicon”, Invited paper, Proc. ECOC’, Cannes, France, 2014.
  • J. Decobert, et al., “240 nm wide wavelength range of AlGaInAs MQWs selectively grown by MOVPE”. Proceedings of Indium Phosphate and Related Mateials Conference, Versailles, 2008.


  • D. J. Thomson, F. Y. Gardes, Y. Hu, G. Mashanovich, M. Fournier, P. Grosse, J-M. Fedeli and G. T. Reed, “High contrast 40Gbit/s optical modulation in silicon,” Optics Express, v 19, n 12, pp. 11507 – 11516, 2011.
  • D. J. Thomson, F. Y. Gardes, S. Liu, H. Porte, L. Zimmermann, J-M Fedeli, Y. Hu, M. Nedeljkovic, X. Yang, P. Petropoulos, and G. Z. Mashanovich, “High performance Mach Zehnder based silicon optical modulators,” IEEE Journal of Selected Topics in Quantum Electronics, 2013.
  • G. T. Reed, G. Z. Mashanovich, F. Y. Gardes, M. Nedeljkovic, D. J. Thomson, L. Ke, P. Wilson, S-W. Chen and S. H. Hsu, “Recent breakthroughs in carrier depletion based silicon optical modulators,” Nanophotonics, pages 1-18, 2013.
  • D. J. Thomson, H. Porte, B. Goll, D. Knoll, S. Lischke, F. Y. Gardes, Y. Hu, G. T. Reed, H. Zimmermann, L. Zimmermann, “Silicon carrier depletion modulator with 10Gbit/s driver realized in high-performance photonic BiCMOS,” Laser & Photonics Reviews, vol. 8, pp. 180-187, 2014.
  • D. J. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L.Virot, J-M. Fédéli, J-M. Hartmann, J. H. Schmid, D-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich and M. Nedeljkovic, “Roadmap on silicon photonics,” IOP Journal of Optics. Vol. 18, n. 7, 2016.


CEA (Commissariat à l’Energie Atomique et aux Energies Alternatives) is a French Governmental Research Organisation (15000 employees) devoted to both fundamental and industrial Research & Development. Within CEA, CEA-LETI is one of the major European research centres for applied electronics. It is located in Grenoble where it operates 11000 m²-State-of-the-Art CMOS clean rooms, 200 and 300 mm wafer size, and the 200 mm MEMS microsystems platform, with equipment worth some 200 M€. Nearly 1,600 men and women are serving innovation and the transfer of technology in key domains, with ST microelectronics as the main industrial partner. CEA-LETI has sparked the creation of nearly thirty high-technology start-ups, including Soitec, world leader in the development/ production of Silicon on insulator wafers.

As a pioneer in Research & Development in Silicon Photonics (2002) CEA-Leti has developed strong expertise and know how in device design, integration and test, including Ge-on-Silicon photodetectors and heterogeneous III/V-on-Silicon lasers. Having achieved the development of world-record-output-power lasers, and 200mm-wafer-size processing, CEA is considered as a leading institute in the field.

Main tasks in PICTURE:

Within the PICTURE project, CEA will enhance its 200 mm silicon photonics platform by implementing a new III-V on Silicon hybrid bonding scheme using a thin oxide bonding layer to obtain optimized hybrid active devices such as hybrid III-V on Si lasers with improved power efficiency and thermal behaviour, very efficient and low power consumption III-V on Si hybrid capacitive modulators and photodiodes. CEA will develop multi-die bonding technology in order to use the expensive III-V material only where it is necessary for active devices and to use III-V epitaxial stacks based on QW or QD active layers separately optimized for the laser, the modulator and the photodetector. Importantly, CEA will develop the whole fabrication process of III-V on Si photonic integrated circuits on its 200 mm CMOS platform to demonstrate the industrial manufacturability. In addition CEA, will work on the design of efficient, low-voltage and low-power consumption hybrid III-V on Si modulators and perform characterization of all the passive and active building blocks up to 67 GHz operation on its Automatic Prober stations.

CEA has developed a 200 mm Silicon photonics platform including passive components such as waveguides, single polarization and polarization-splitting fiber couplers, multiplexers /demultiplexers and active components operating at 25 Gb/s such as Si modulators based on a PN junction in depletion and Ge photodetectors. CEA has developed an expertise in the design of all these components and in particular on the design of silicon modulators based on various junction types such as PN, PIN and capacitive junctions.

CEA has also successfully developed the integration of III-V lasers DBR and DFB lasers based on the direct bonding of III-V wafers on Silicon, and their integration with silicon modulators.

Dr. Karim Hassan, project board member for LETI of PICTURE  received his PhD degree in physics from the University of Burgundy, Dijon, France, in 2013 on the development of thermo-optical plasmonic routers for telecom applications in the framework of the FP7 project PLATON.  He joined CEA-Leti in 2014 where he works currently on silicon photonics as research fellow (H2020 COSMICC, ANR IRT-Nanoelec) and manager of the FP7 project SEQUOIA. His research interest includes the design, fabrication, and characterization of silicon photonics circuits, hybrid III-V on silicon laser sources, and topological optimization for nanophotonics. He has authored or coauthored more than 50 journal publications, conference papers and patents.

The following projects are among those referring to silicon photonic integration carried out at LETI


  • Siming Chen, Wei Li, Jiang Wu, Qi Jiang, Mingchu Tang, Samuel Shutts, Stella N Elliott, Angela Sobiesierski, Alwyn J Seeds, Ian Ross, Peter M Smowton, Huiyun Liu, “Electrically pumped continuous-wave III–V quantum dot lasers on silicon”, Nature Photonics 10, 307–311 (2016)
  • Jonathan R Orchard, Samuel Shutts, Angela Sobiesierski, Jiang Wu, Mingchu Tang, Siming Chen, Qi Jiang, Stella Elliott, Richard Beanland, Huiyun Liu, Peter M Smowton, David J Mowbray, “In situ annealing enhancement of the optical properties and laser device performance of InAs quantum dots grown on Si substrates”, Optics Express 24 (6), 6196-6202
  • Andrew Lee, Qi Jiang, Mingchu Tang, Alwyn Seeds, and Huiyun Liu, “Continuous-wave InAs/GaAs quantum-dot laser diodes monolithically grown on Si substrate with low threshold current densities”, Optics Express, 20, 22181-22187 (2012)
  • H. Liu, T. Wang, Q. Jiang, R. Hogg, F. Tutu, F. Pozzi, A. Seeds, “Long-wavelength InAs/GaAs quantum-dot laser diode monolithically grown on Ge substrate”, Nature Photonics 5, 416 (2011)
  • T. Wang, H. Liu, A. Lee, F. Pozzi, A. Seeds, “1.3-μm InAs/GaAs quantum-dot lasers monolithically grown on Si Substrate”, Optics Express 19, 11381 (2011)


Imec performs world-leading research in nanoelectronics and leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec is an independent research centre, founded by the Belgian Flemish Government in 1984. The Department of Information Technology (INTEC) of Ghent University (UGent) act as an associated division of IMEC since 1984. As from October 1, 2016, imec merged with iMinds, resulting in one of the largest digital ICT research institutes in Europe.

The imec-IDLab Design research group has been very active in optoelectronic front-end and (sub-) system design since the early nineties. The IDLab-Design group is currently one of the leading groups in the research and development of high-speed, low-power transmitter and receiver integrated circuits for next generation transport, metro, access, datacenter and radio-over-fiber networks. Developments are ongoing in the frame of various FP7 projects (Phoxtrot and Spirit), and continuing the frame of H2020 (Flex5Gware, Teraboard, Streams, WIPE, Optima and 5GPHOS). In Nov. 2014, the Design group was awarded the 3rd biannual Greentouch 1000x award together with Bell Labs/Alcatel-Lucent and Orange Labs. 

Expertise and tasks in PICTURE

IMEC IDLab-Design group has a proven track record with successful development and demonstrations of advanced electronics and PICs ttps:// The linear driver and TIA designs build further on our recent and ongoing developments of high-speed (segmented) MZM drivers, ring modulator/VCSEL/EAM drivers, and linear TIAs in the framework of various FP7 and H2020 projects.

In PICTURE, IMEC is mainly responsible for developing low-power linear III-V/Si hybrid modulator driver and linear trans-impedance amplifier arrays for coherent transceiver PICs. Moreover, IMEC will use their expertise in high-speed/MW/RF to contribute to new travelling-wave electrode III-V/Si hybrid modulator designs in WP2. 

Infrastructure, projects and activities connected to PICTURE

FP7 SPIRIT ( SPIRIT develops Terabit coherent optical transport networks. In Spirit, the main contribution from Imec-IDLab is the design and prototyping of flexible CMOS IQ modulator driver electronics which are closely integrated and co-designed with a segmented MZM from Fraunhofer HHI.

- H2020 STREAMS ( STREAMS develops Silicon Photonics Transceiver and Routing technologies for a WDM-based, Tb/s, optical on-board interconnection system towards exa-scale computing systems. The main contribution from imec-IDLab is the design and prototyping of 50Gb/s electro-absorption modulator driver arrays and 50Gb/s TIA arrays with low-power consumption.

- H2020 TERABOARD ( TERABOARD develops a combination of ultra-low-power high-bandwidth-density data communications designed  for the server and packet-processing boards of datacenters. The main contribution from imec-IDLab is the design and prototyping of 56Gb/s ring modulator driver arrays and 56Gb/s TIA arrays with low-power consumption. 

Imec commits its well-equipped test lab with >50Gb/s pattern generator and error detector, FPGA-based bit-error rate characterization up to 100Gb/s, non-linear network analysis up to 67GHz for 4-port devices, sampling oscilloscopes (up to 70GHz), and 4-channel 92GS/s Arbitrary Waveform Generator and 160GS/s Real-Time Oscilloscope. Imec-IDLab-Design can rely on extensive experience in the field, a faradized 160m2 test laboratory and a wide range of advanced software and chip design kits, also including tools for the detailed simulation of 3D electromagnetic fields, interconnection parasitics, and the detailed behaviour of high-speed circuits supported by a powerful computing environment. 

The scientists will be primarily responsible for carrying out research and innovation activities.

Prof. Xin (Scott) Yin received the Ph.D. degree in applied sciences, electronics from Ghent University, Ghent, Belgium in 2009. He has been a research assistant in the IMEC/INTEC Design laboratory, Ghent University since 2003 and since 2013 he is also a professor with Ghent University. He is active in European and international projects such as DISCUS, Phoxtrot, Mirage, GreenTouch, Spirit, Teraboard, Streams and WIPE. His current research interests include high-speed opto-electronic circuits and subsystems, with emphasis on burst-mode receivers, clock and data recovery and electronic dispersion compensation for optical access networks, and low-power mixed-signal integrated circuit design for telecom/Datacom/5G/IoT applications. In 2014, he led a team including researchers from imec, Bell Labs USA/Alcatel-Lucent and Orange Labs, which won the GreenTouch 1000x award in recognition of the invention of the Bi-PON protocol and sustained leadership. He is a member of the ECOC technical program committee (TPC) since 2015.

Prof. Johan Bauwelinck received a Ph.D. degree in applied sciences, electronics from Ghent University, Belgium in 2005. Since Oct. 2009 he is a professor in the IDLab research group of the department of Information Technology (INTEC) at the same university where he is leading the Design lab since 2014. He became a guest professor at iMinds in the same year, now imec since 2016. His research focuses on high-speed, high-frequency (opto-) electronic circuits and systems, and their applications on chip and board level, including transmitter and receiver analog front-ends for wireless, wired and fiber-optic communication or instrumentation systems. He was and is active in the EU-funded projects GIANT, POWERNET, PIEMAN, EuroFOS, C3-PO, Mirage, Phoxtrot, Spirit, Flex5Gware, Teraboard, Streams, WIPE and Optima conducting research on advanced electronic integrated circuits for next generation transport, metro, access, datacenter and radio-over-fiber networks. He has promoted 18 PhDs and co-authored more than 200 publications and 10 patents in the field of high-speed electronics and fiber-optic communication. 

Main Contact

Prof. dr. ir. Xin (Scott) Yin

IMEC - Ghent University

Technologiepark 15

9052 Gent-Zwijnaarde, Belgium

Email: This email address is being protected from spambots. You need JavaScript enabled to view it., This email address is being protected from spambots. You need JavaScript enabled to view it.

Tel: +32 9 264 33 36 


  • N. Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. O’Brien, "Optical and Electronic Packaging Processes for Silicon Photonic Systems," Journal of Lightwave Technology 33(5), 991-997 (2015).
  • “Hybrid integration of wavelength-tunable laser with silicon photonic integrated circuit”, B. Snyder, B.Corbett and P O’Brien, IEEE J. Light Tech., December 2013.
  • “Hybrid Integration of Laser Source on Silicon Photonic Integrated Circuit for low-cost Interferometry Medical Device” M. Duperron, Lee Carroll, M. Rensing, S. Collins, Y. Yanlu Li, R. Baets, P. O’Brien


  • Zoldak, M., Halmo, Turkiewicz, J.P., Stefan Schumann, Henker, R.,.,"Packaging of ultra-high speed optical fiber data interconnects" Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250R (February 10, 2017); doi:10.1117/12.2271032

Nokia-Bell Labs

  • Ghazisaeidi et al., “65Tb/s Transoceanic Transmission Using Probabilistically-Shaped PDM-64QAM”, in Proc. ECOC 2016, Paper Th3C4.
  • R. Rios-Müller et al., “Practical Approaches to 400G Single-Carrier Submarine Transmission,” in Proc. OFC 2016, p. Th1B.4.
  • R. Rios-Muller et al., “Multi-Dimension Coded PAM4 Signaling for 100Gb/s Short- Reach Transceivers,” in Proc. OFC 2016, p. Th1G.4.
  • J. Renaudier et al., “Multi Rate IMDD Transceivers for Optical Interconnects Using Coded Modulation” In Proc. OFC 2016, p. Tu2J-2.
  • Ghazisaeidi et al., “54.2 Tb/s Transoceanic Transmission using Ultra low loss fiber, multi-rate FEC and digital nonlinear mitigation’’, in Proc. ECOC 2015, pp. 1-3.

Project Support

III-V Labs
Campus de Polytechnique
1, avenue Augustin Fresnel
F-91767 Palaiseau Cedex
Phone : + 33 1 69 41 55 00
Arnaud Wilk

Quick Links

  • Picture-h2020 Project Intranet
  • Silicon Photonics Group website
  • Picture-h2020 Events