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COVID-19

To tackle COVID-19 European governments are imposing restrictions on our daily activities for the foreseeable future. As individuals, and as a community, we have a shared responsibility to follow the latest public advice as strictly as possible to tackle the spread of COVID-19. 
At a time of global crisis, the  PICTURE consortium  is rising to the challenge. We are now working from home and most of our laboratories and clean room complexes are closed. 
It is not business as usual but our business does not stop.
We have a unique opportunity to think, to progress our work via innovative design and modelling, to write papers , and to use digital technology to engage with the community in innovative ways. Our operations have swiftly migrated online and we will update our partners and collaborators on effective ways of working with us as appropriate.
We are proud of the fact that over many decades our contributions to the global internet are helping keep the world running through this difficult time. It is a timely reminder that connectivity provides resilience and we are redoubling our efforts to ensure that that the next generation of optoelectronic hardware is available when we need it.
We are enormously grateful to our sponsors and staff for bearing with us in these difficult times. Your generous support and positive energy ensure our community continues to thrive.

III-V LAB

  • H. Duan, S. Olivier, C. Jany, S. Malhouitre, A. Le Liepvre, A. Shen, X. Pommarede, G. Levaufre, N. Girard, D. Make, G. Glastre, J. Decobert, F. Lelarge, R. Brenot, and B. Charbonnier “Hybrid III-V Silicon Photonic Integrated Circuits for Optical Communication Applications”, Invited paper, IEEE. J. Selected Topics on Quantum Electronics, vol. 22, No. 6, OVEMBER/DECEMBER 2016
  • G-H. Duan, A. Accard, P. Kaspar, C. Jany,, A. Le Liepvre, D. Make, G. Levaufre, N. Girard, A. Shen, J. Decobert, N. Legay, F. Lelarge, F. Mallecot, P. Charbonnier, H. Gariah, J.-L. Gentner, S. Olivier, S. Malhouitre, C. Kopp, and S. Menezo, “New Advances on Heterogeneous Integration of III-V on Silicon”, Invited paper, J. Lightwave Technology, 2015.
  • H. Duan, C. Jany, A. Le Liepvre, A. Accard, M. Lamponi, D. Make, P. Kaspar, et al., « Hybrid III-V on Silicon UNITYfor photonic integrated circuits on Silicon”, Invited Paper, IEEE. J. Selected Topics on Quantum Electronics, vol.. 20, No. 4, JULY/AUGUST 2014.
  • G-H. Duan, A. Accard, P. Kaspar, C. Jany,, A. Le Liepvre, D. Make, G. Levaufre, N. Girard, A. Shen, J. Decobert, N. Legay, F. Lelarge, F. Mallecot, P. Charbonnier, H. Gariah, J.-L. Gentner, S. Olivier, S. Malhouitre, C. Kopp, and S. Menezo, “New Advances on Heterogeneous Integration of III-V on Silicon”, Invited paper, Proc. ECOC’, Cannes, France, 2014.
  • Decobert, et al., “240 nm wide wavelength range of AlGaInAs MQWs selectively grown by MOVPE”. Proceedings of Indium Phosphate and Related Mateials Conference, Versailles, 2008.

SOUTHAMPTON

  • J. Thomson, F. Y. Gardes, Y. Hu, G. Mashanovich, M. Fournier, P. Grosse, J-M. Fedeli and G. T. Reed, “High contrast 40Gbit/s optical modulation in silicon,” Optics Express, v 19, n 12, pp. 11507 – 11516, 2011.
  • J. Thomson, F. Y. Gardes, S. Liu, H. Porte, L. Zimmermann, J-M Fedeli, Y. Hu, M. Nedeljkovic, X. Yang, P. Petropoulos, and G. Z. Mashanovich, “High performance Mach Zehnder based silicon optical modulators,” IEEE Journal of Selected Topics in Quantum Electronics, 2013.
  • T. Reed, G. Z. Mashanovich, F. Y. Gardes, M. Nedeljkovic, D. J. Thomson, L. Ke, P. Wilson, S-W. Chen and S. H. Hsu, “Recent breakthroughs in carrier depletion based silicon optical modulators,” Nanophotonics, pages 1-18, 2013.
  • J. Thomson, H. Porte, B. Goll, D. Knoll, S. Lischke, F. Y. Gardes, Y. Hu, G. T. Reed, H. Zimmermann, L. Zimmermann, “Silicon carrier depletion modulator with 10Gbit/s driver realized in high-performance photonic BiCMOS,” Laser & Photonics Reviews, vol. 8, pp. 180-187, 2014.
  • J. Thomson, A. Zilkie, J. E. Bowers, T. Komljenovic, G. T. Reed, L. Vivien, D. Marris-Morini, E. Cassan, L.Virot, J-M. Fédéli, J-M. Hartmann, J. H. Schmid, D-X. Xu, F. Boeuf, P. O’Brien, G. Z. Mashanovich and M. Nedeljkovic, “Roadmap on silicon photonics,” IOP Journal of Optics. Vol. 18, n. 7, 2016.

UCL

  • Siming Chen, Wei Li, Jiang Wu, Qi Jiang, Mingchu Tang, Samuel Shutts, Stella N Elliott, Angela Sobiesierski, Alwyn J Seeds, Ian Ross, Peter M Smowton, Huiyun Liu, “Electrically pumped continuous-wave III–V quantum dot lasers on silicon”, Nature Photonics 10, 307–311 (2016)
  • Jonathan R Orchard, Samuel Shutts, Angela Sobiesierski, Jiang Wu, Mingchu Tang, Siming Chen, Qi Jiang, Stella Elliott, Richard Beanland, Huiyun Liu, Peter M Smowton, David J Mowbray, “In situ annealing enhancement of the optical properties and laser device performance of InAs quantum dots grown on Si substrates”, Optics Express 24 (6), 6196-6202
  • Andrew Lee, Qi Jiang, Mingchu Tang, Alwyn Seeds, and Huiyun Liu, “Continuous-wave InAs/GaAs quantum-dot laser diodes monolithically grown on Si substrate with low threshold current densities”, Optics Express, 20, 22181-22187 (2012)
  • Liu, T. Wang, Q. Jiang, R. Hogg, F. Tutu, F. Pozzi, A. Seeds, “Long-wavelength InAs/GaAs quantum-dot laser diode monolithically grown on Ge substrate”, Nature Photonics 5, 416 (2011)
  • Wang, H. Liu, A. Lee, F. Pozzi, A. Seeds, “1.3-μm InAs/GaAs quantum-dot lasers monolithically grown on Si Substrate”, Optics Express 19, 11381 (2011)

TYNDALL

  • Pavarelli, J. S. Lee, M. Rensing, C. Scarcella, S. Zhou, P. Ossieur, and P. O’Brien, "Optical and Electronic Packaging Processes for Silicon Photonic Systems," Journal of Lightwave Technology 33(5), 991-997 (2015).
  • “Hybrid integration of wavelength-tunable laser with silicon photonic integrated circuit”, B. Snyder, B.Corbett and P O’Brien, IEEE J. Light Tech., December 2013.
  • “Hybrid Integration of Laser Source on Silicon Photonic Integrated Circuit for low-cost Interferometry Medical Device” M. Duperron, Lee Carroll, M. Rensing, S. Collins, Y. Yanlu Li, R. Baets, P. O’Brien

ARGOTECH

  • Zoldak, M., Halmo, Turkiewicz, J.P., Stefan Schumann, Henker, R.,.,"Packaging of ultra-high speed optical fiber data interconnects" Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250R (February 10, 2017); doi:10.1117/12.2271032

NOKIA-BELL LABS

  • Ghazisaeidi et al., “65Tb/s Transoceanic Transmission Using Probabilistically-Shaped PDM-64QAM”, in Proc. ECOC 2016, Paper Th3C4.
  • Rios-Müller et al., “Practical Approaches to 400G Single-Carrier Submarine Transmission,” in Proc. OFC 2016, p. Th1B.4.
  • Rios-Muller et al., “Multi-Dimension Coded PAM4 Signaling for 100Gb/s Short- Reach Transceivers,” in Proc. OFC 2016, p. Th1G.4.
  • Renaudier et al., “Multi Rate IMDD Transceivers for Optical Interconnects Using Coded Modulation” In Proc. OFC 2016, p. Tu2J-2.
  • Ghazisaeidi et al., “2 Tb/s Transoceanic Transmission using Ultra low loss fiber, multi-rate FEC and digital nonlinear mitigation’’, in Proc. ECOC 2015, pp. 1-3.

Project Support

III-V Labs
Campus de Polytechnique
1, avenue Augustin Fresnel
F-91767 Palaiseau Cedex
Phone : + 33 1 69 41 55 00
Arnaud Wilk 
arnaud.wilk@3-5lab.fr

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