Project Overview

Project overview

Title	Hits
Work Package 1 – Heterogeneous integration using a thin bonding layer	5189
Work Package 2 – Hybrid III-V/Si building blocks for PICs	4196
WORK PACKAGE 3 - Direct growth on template	4193
WP4- High performance PICs: design, prototyping and assessment - (UCC, III V LAB GIE, CEA, IMEC, AT, NBLF)	4139

III-V Labs
Campus de Polytechnique
1, avenue Augustin Fresnel
F-91767 Palaiseau Cedex
Phone : + 33 1 69 41 55 00
Arnaud Wilk
arnaud.wilk@3-5lab.fr