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Project Overview

Project overview

Title Hits
Work Package 1 – Heterogeneous integration using a thin bonding layer 411
Work Package 2 – Hybrid III-V/Si building blocks for PICs 438
WORK PACKAGE 3 - Direct growth on template 339
WP4- High performance PICs: design, prototyping and assessment - (UCC, III V LAB GIE, CEA, IMEC, AT, NBLF) 287

Project Support

III-V Labs
Campus de Polytechnique
1, avenue Augustin Fresnel
F-91767 Palaiseau Cedex
Phone : + 33 1 69 41 55 00
Arnaud Wilk 
arnaud.wilk@3-5lab.fr

Quick Links

  • Picture-h2020 Project Intranet
  • Silicon Photonics Group website
  • Picture-h2020 Events