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Latest technological achievements from CEA-LETI for H2020 PICTURE project was exhibited in OFC 2020 San Diego last week:

III-V on Silicon heterogeneous die bonding with a thin 20nm bonding oxide interface was demonstrated on a 200mm platform.

This technology collectively bonds four different types of III-V dies with high spatial accuracy for the realization of O-band and C-band lasers, SOAs, capacitive modulators, and photodiodes for next generation high-speed transceivers.

Eléonore Hardy Business Developer, Bertrand Szelag Head of Silicon Photonics Lab, OFC2020 San Diego 10-12 March
Eléonore Hardy Business Developer, Bertrand Szelag Head of Silicon Photonics Lab, OFC2020 San Diego 10-12 March

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Project Support

III-V Labs
Campus de Polytechnique
1, avenue Augustin Fresnel
F-91767 Palaiseau Cedex
Phone : + 33 1 69 41 55 00
Arnaud Wilk 
arnaud.wilk@3-5lab.fr

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  • Picture-h2020 Project Intranet
  • Silicon Photonics Group website
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