PICTURE technology was exhibited in OFC 2020 San Diego
Latest technological achievements from CEA-LETI for H2020 PICTURE project was exhibited in OFC 2020 San Diego last week:
III-V on Silicon heterogeneous die bonding with a thin 20nm bonding oxide interface was demonstrated on a 200mm platform.
This technology collectively bonds four different types of III-V dies with high spatial accuracy for the realization of O-band and C-band lasers, SOAs, capacitive modulators, and photodiodes for next generation high-speed transceivers.
